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Tuesday 17th November 2020
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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Chris Meadows, Conference Chair
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09:00
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Enabling wider mobile bandwidth no matter what frequency you choose.
Presented by Ben Thomas - Qorvo
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09:25
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Assessing the impact of 5G front-ends on the world' leading GaAs fabs
Presented by Eric Higham - Strategy Analytics
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09:45
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Millimetre-wave MMICs and integrated solutions enabling high-throughput 5G deployments
Presented by Eric Leclerc - United Monolithic Semiconductors
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10:05
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The future of Germanium: Breakthrough Opportunities
Presented by Pieter Arickx - Umicore
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10:25
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Improving yield for 5G market through defect inspection and metrology
Presented by Varun Gupta - KLA Corporation
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10:45
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5G’s impact on RF Front-End: from Telecom Infrastructure to Handsets
Presented by Claire Troadec - Yole Développement
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11:05
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Morning Break - Sponsored by Hewlett Packard Enterprise
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Seeking new opportunities for LEDs and lasers
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Sponsored by Inspectrology
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11:35
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Improving the architecture of the GaN VCSEL
Presented by Tatsushi Hamaguchi - Sony Corp.
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12:00
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Can MicroLEDs and VCSELs revolutionize the Solid State Lighting Industry?
Presented by Pars Mukish - Yole Developpement
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12:20
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Refining microLED technology
Presented by Wei Sin Tan - Plessey Semiconductors
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12:40
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Lunch Break - Sponsored by Hewlett Packard Enterprise
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13:55
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Advanced technology of plasma dicing for GaAs VCSEL
Presented by Akihiro Itou - Panasonic
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14:15
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Optimizing 200mm Metal Lift-off for Smaller Dimensions
Presented by Philip Greene - Ferrotec
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14:35
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Recent trends in LED and LASER diode device material characterization
Presented by Yves Lacroix - YSystems Ltd
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14:55
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Afternoon Break - Sponsored by Hewlett Packard Enterprise
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15:25
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Highly uniform films and tool stability - key drivers for Micro LED production
Presented by Stefan Seifried - Evatec
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15:45
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Presentation Title to be Confirmed
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16:05
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Seeking new opportunities for LEDs and lasers
Presented by Samuel Sonderegger - Attolight
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16:25
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Leading-Edge MOCVD Technology Enabling Next-Generation Photonics Applications
Presented by Mark McKee - Veeco
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16:45
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Compound Semiconductor Integration – Wafer Bonding towards new Di(e)mensions
Presented by Thomas Uhrmann - EV Group
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17:10
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Networking Drinks Reception and Dinner
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Wednesday 18th November 2020
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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Chris Meadows, Conference Chair
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09:00
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Driving the revolution in wide bandgap devices
Presented by John Palmour - Wolfspeed
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09:25
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The SiC & GaN Power Semiconductor Market: Forecasts and Drivers
Presented by Richard Eden - IHS Markit
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09:45
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Driving the adoption of CoolGaN technology
Presented by Gerald Deboy - Infineon
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10:05
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Solutions for high volume manufacturing of wide bandgap materials
Presented by Jens Voigt - AIXTRON
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10:25
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Expanding opportunities for 650 V GaN FETs
Presented by Frédéric Dupont - Exagan
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10:45
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Latest technologies for laser dicing, blade dicing of SiC and new ultra-thin grinding
Presented by Gerald Klug - DISCO HI-TEC EUROPE GmbH
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11:05
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Reinforcement Factories
Presented by Julie Orlando - Nanotronics
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11:25
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Morning Break - Sponsored by Hewlett Packard Enterprise
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11:55
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Using high speed XRDI to improve and monitor SiC substrate quality
Presented by Paul Ryan - Bruker
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12:15
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Advanced in-situ metrology for high-yield epitaxy of SiC/SiC, GaN/SiC and GaN/Si device structures
Presented by Iris Claussen - Laytec
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12:35
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Presentation Title to be Confirmed - Revasum
Presented by Rob Rhoades - Revasum
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12:55
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200mm GaN Power: Technology and Commercialization Status on Scalable QST® Platform
Presented by Vlad Odnoblyudov - QROMIS
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13:15
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Advanced Plasma Processing solutions enabling the cost down per wafer and critical device performance required to accelerate the HVM of GaN and SiC Power devices.
Presented by Frazer Anderson - Oxford Instruments
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13:35
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Lunch Break - Sponsored by Hewlett Packard enterprise
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14:50
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Ramping production of gallium oxide diodes and transistors
Presented by Takashi Shinohe - FLOSFIA
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15:15
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A New Technology of Commercialization for GaN on Diamond HEMTs
Presented by Won Sang Lee - RFHIC US Corp
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15:35
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Presentation Title to be Confirmed - EpiGaN
Presented by Marianne Germain - EpiGaN
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15:55
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High-power blue VCSELs and VCSEL arrays
Presented by Masaru Kuramoto - Stanley Electric
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16:20
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Compound semiconductor adoption by automotive market
Presented by Ezgi Dogmus - Yole Développement
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16:40
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Electrochemical Deposition of Gold as Optimal Choice for Device Cost and Performance
Presented by John Ghekiere - ClassOne
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17:00
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New CS Markets Challenge Traditional Reliability Testing Paradigms
Presented by Roland Shaw - Accel RF
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17:20
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SiC: From Niche to Mass Production
Presented by Aly Mashaly - Rohm Semiconductor
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17:40
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Speeding On-board Charging with Automotive-qualified GaN FETs
Presented by Philip Zuk - Transphorm
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Presentation times and order are subject to change. This agenda was last updated on 01 Apr 2020 at 9:29pm.
