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Monday 20th April 2026 starting at 11:00 CET
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11:00
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AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register
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18:00
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Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)
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Tuesday 21st April 2026 starting at 08:00 CET
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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Conference Chairs
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Growing Revenues in GaN Power Electronics
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09:00
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Radiation Hardened High Voltage GaN Technology to Enable a Permanent Human Presence on the Moon and Beyond
Presented by Antxon Arrizabalaga - Semi Zabala
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09:15
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Advancing GaN Power Technologies: Scaling to 300 mm for the AI Era
Presented by Pierre Gassot - imec
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09:30
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Analytical X-Ray Solutions for Thin Film and Wafer Analysis
Presented by Name to be advised - Malvern Panalytical
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09:45
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GaN Comes of Age: From Fast Chargers to Strategic Power Platforms
Presented by Roy Dagher - Yole Group
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10:00
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D3GaN Power Modules for Automotive Inverters Achieving 99.7% WLTP Efficiency
Presented by Dieter Liesabeths - VisIC Technologies
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10:15
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Presentation by AIXTRON
Presented by Vincent Meric - AIXTRON
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10:30
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Morning Break - Refreshments & Networking
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11:00
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Improving GaN with a Dash of Oxygen
Presented by Robert Mears - Atomera
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11:15
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Chemical Vapor Deposition of Nitrides by Carbon-free Precursors
Presented by Stefano Leone - Fraunhofer Institute IAF
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11:30
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Analysis of Gallium Nitride Epilayers by Multi-ion Species Plasma-FIB and S/TEM Techniques
Presented by Martin Čalkovsky - Thermofisher
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11:45
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Tunable Epi System for GaN HEMT
Presented by Dong Sik Suh - TES Co. Ltd
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12:00
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High Performance GaN Power Devices Enabled by Wafer Bonding
Presented by Elisabeth Brandl - EV Group
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microLEDs: How to gain market traction
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12:15
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From Display to System: Enabling System-on-Panel Architectures Using MicroLEDs and MicroSolid Printing™
Presented by Reza Chaji - VueReal
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12:30
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Scalable MicroLED optical link prototype fabrication for the next generation computing
Presented by Vygintas Jankus - CEA-Leti
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12:45
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Lunch Break and Networking
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14:15
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Startup Elevator Presentations
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Revitalising the SiC industry
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14:25
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Enabling Advanced Silicon Carbide R&D with 200-mm Open-Innovation Pilot Line at IME, A*STAR Singapore
Presented by Umesh Chand - A*STAR
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14:40
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Further Growth Opportunities for SiC in New Application Fields
Presented by Peter Friedrichs - Infineon
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14:55
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Advanced Metrology Strategies for High-Yield SiC Manufacturing in Mature and Emerging Power Markets
Presented by Tamzin Lafford - Bruker UK
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15:10
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Quantifying What Matters in SiC Fabs: Inline TXRF, HRXRD, and XRR for Yield Control
Presented by Meredith Beebe - Rigaku
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15:25
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Enhancing Yield in Compound Semiconductor Processing
Presented by Serge Jedwab - Siconnex
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15:40
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Achieving High-Quality Monocrystals at Scale
Presented by Name to be advised - EEMCO
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15:55
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Afternoon Break and Networking
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16:25
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Electrical Parametric Characterization of Wide-Bandgap Semiconductor Wafers and Devices
Presented by Maarten Raimond - Tektronix
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16:40
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SiC: The Trusted Partner and Growth Engine for the High-Power Conversion Industry
Presented by Mrinal K. Das - onsemi
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16:55
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RAITH VECTOR in Compound Semiconductors
Presented by Jean-Claude Menard - Raith
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17:10
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Further presentations to follow
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18:15
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Networking Drinks / Dinner Reception
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Wednesday 22nd April 2026 starting at 08:00 CET
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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Conference Chairs
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Advancing surface-emitting optoelectronics
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09:00
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Development of Strain-compensated Distributed Bragg Reflectors for GaN-based VCSELs With Potential for Faster Growth and Higher Productivity
Presented by Takeshi Kawashima - Ricoh
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09:15
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Unlocking the Future: Nanoporous Compound Semiconductor Technology for Next-Gen Sensing, Digital Health and Energy-Efficient Data Centers Optical Interconnect
Presented by Jung Han - InPHRED
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09:30
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Manufacturing VCSELs on 150mm and 200mm Wafer Formats
Presented by Peter Smowton - Cardiff University
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09:45
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Enabling As/P Epitaxy at Scale for Photonics, Optoelectronics, and Solar
Presented by Vinod Merai - Veeco
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10:00
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Presentation by Huawei Technologies Research & Development
Presented by Graham Berry - Huawei Technologies Research & Development
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10:15
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Presentation by Vector Photonics
Presented by Richard Taylor - Vector Photonics
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10:35
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Morning Break - Refreshments & Networking
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Unlocking the potential of ultra-wide bandgap materials
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11:05
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Gallium Oxide RF Electronics: Recent Advances Toward Unlocking UWBG Potential
Presented by Min Zhou - Xidian University
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11:20
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12" SiC – Wafering Solutions for AR and Advanced Packaging
Presented by Malte Mueller - Lapmaster Wolters
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11:35
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High Voltage Power Technology with Gallium Oxide and AlGaN
Presented by Martin Kuball - University of Bristol
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11:50
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Towards More Efficient Power Transistors: Modulation-Doped β-(AlₓGa₁₋ₓ)₂O₃/Ga₂O₃ Heterostructures with Enhanced Electron Mobility
Presented by Andreas Fiedler - Leibniz-Institut für Kristallzüchtung (IKZ)
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12:05
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Scaling SiC lessons for ultra-wide bandgap commercialisation
Presented by Ajay Poonjal Pai - Sanan
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12:20
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Lunch Break and Networking
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13:50
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Further presentations to follow
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Presentation times and order are subject to change. This agenda was last updated on 25 Feb 2026 at 2:04am.