| A Hybrid Defect Inspection System for SiC substrate and Epi applications |
Aris Ma |
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| Accelerating semiconductor technologies for the green revolution |
Shiva Rai |
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| Capital Efficient Systems for SiC Manufacturing Expansion and R&D |
Brian Stickney |
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| Challenges and solutions in new generation SiC metrology |
Dr. Eszter Najbauer |
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| Challenges in HVM Amidst Evolving Device Architectures and Requirements for Compound Semiconductor based Power Devices |
Nick Keller |
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| Cutting-edge SiC Manufacturing: Beyond Chemical-Mechanical Constraints |
Philipp Böttger |
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| Enabling Low Cost SiC Boule Fabrication – The BoulePro 200AX is the New Process Of Record |
Jeff Gum |
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| Giving SiC a superjunction |
Reza Ghandi |
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| Industry ready detection of TSDs and BPDs in SiC wafers |
Dr.-Ing. Christian Reimann |
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| Modernizing Industrial Low Voltage Motor Drives with Silicon Carbide |
Pranjal Srivastava |
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| Next-Generation Factory Inspection: Improving Performance by Synthesizing Intelligent Microscopy |
Marius Fischer |
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| Powering the SiC Revolution with Vertical Integration |
Ajay Poonjal Pai |
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| PulseForge and Teikoku Taping Systems Announce Novel Fully Automated Photonic Debonding Platform |
Vahid Akhavan |
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| Sample preparation and TEM imaging techniques for advanced power device analysis |
Antonio Mani |
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| Sharpening SiC Wafer specs and Frontend Performance by Crystal Orientation Metrology |
Lars Grieger |
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| Silicon Carbide: a game changer in power electronics |
Mario Saggio |
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| Supporting SiC Success Stories Through Technical Innovation |
David Liese |
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| The Unspoken Impacts of SiC Power Packaging |
Kevin Speer |
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