Abstracts

Two days, 5 themes, over 30 inspiring presentations

Presentation at CS International 2020 are grouped into 5 key themes which collectively provide complete coverage of the compound semiconductor industry.

If you are interested in speaking at CS International 2020, please contact [email protected] or call +44 (0)24 7671 8970.

2020 Speakers Include

AIXTRON
Attolight
Bruker
ClassOne
DISCO HI-TEC EUROPE
EpiGaN
EV Group
Evatec
Exagan
Ferrotec
FLOSFIA
IHS Markit
Infineon
KLA Corporation
Laytec
Nanotronics
Nanowin
Panasonic
Plessey Semiconductors
Qromis
Revasum
RFHIC US Corp
Sony Corp.
Stanley Electric
Strategy Analytics
Transphorm
United Monolithic Semiconductors
Veeco
Wolfspeed
Yole Développement
YSystems Ltd

2020 Presentation Abstracts

Satisfying demand for more data
This theme is sponsored by JTA/Takatori

Assessing the impact of 5G front-ends on the world' leading GaAs fabs

Presented by Eric Higham, Strategy Analytics

As 5G network and device deployments increase, the electronics industry is realizing that this is both a blessing and a curse. The blessing is these new applications will increase quantities at a time when the market is flattening. The curse is that backhaul requirements create more optical backhaul and transport opportunities. This presentation explores drivers and trends for data traffic and the impact on GaAs content in front-ends. It will also address the GaAs opportunities in fiber transport applications and assess the GaAs foundry capabilities in this supply chain versus the pure-play RF GaAs foundries.

Improving yield for 5G market through defect inspection and metrology

Presented by Mukundkrishna Raghunathan, KLA Corporation

Due to its higher power efficiency, GaN is heir apparent to silicon for 5G RF applications. GaN-based 5G power amplifiers can efficiently handle higher voltage in a much smaller area than comparable laterally diffused MOSFET (LDMOS) devices. Another factor which makes GaN attractive is its ability to power a much wider range of mmWave 5G frequencies than standard silicon. However, growing GaN epitaxial wafers has unique challenges. The quality of substrate wafer or non-optimal metal organic chemical vapor deposition (MOCVD) reactor conditions may impact device yield or reliability due to the presence of killer defects on the epitaxial layer. When there is a mismatch between the lattice constant and the thermal expansion coefficient of the epitaxial and substrate materials, high lattice stress may also lead to cracking and/or slip lines. We will discuss how multiple complementary inspection and metrology techniques can be used to detect critical defects on GaN wafers. We will also discuss how feedback from inspection & metrology systems can be used effectively to improve device yield.

Millimetre-wave MMICs and integrated solutions enabling high-throughput 5G deployments

Presented by Eric Leclerc, Field Marketing Manager, United Monolithic Semiconductors

Awaiting presentation abstract.

 
Seeking new opportunities for LEDs and lasers
This theme is sponsored by Inspectrology

Advanced technology of plasma dicing for GaAs VCSEL

Presented by Akihiro Itou, Panasonic

Vertical-cavity surface-emitting lasers (VCSELs) are now key optical sources in gigabit ethernet, high-speed optical-area networks, and computer links because of the advantages they offer, such as low threshold current and a small structure. During conventional blade dicing of VCSELs fabricated on gallium-arsenide (GaAs) substrates, GaAs wafers are fragile and chipping or edge cracks can easily occur. Hence, in the case of conventional saw processes, generally the kerf must be wider and the blade feed speed must be slower in order to avoid device damage due to chipping or edge cracks, which cause limitation of productivity. Plasma dicing has been proposed as a new wafer singulation method. The plasma dicing process is a technology to dice the entire wafer into chips at once [3]. As the wafer is processed using a chemical reaction by plasma, plasma dicing does not cause any physical damage to chips, regardless of the wafer thickness. Thus, the plasma dicing process eliminates chipping and cracks at the edge of chips. In addition, the number of chips which can be taken from one wafer are able to be increased by reducing kerf width, which is approximately the same as the opening width of photo resist during the lithography process before plasma dicing. In this report, we apply plasma dicing to VCSEL on GaAs substrate and demonstrate GaAs dicing, with no chipping at the edge of VCSELs or surface particles.

High Performance Arsenide/Phosphide (As/P) MOCVD Technology for Next-generation Photonics Applications

Presented by Mark McKee, Veeco

Awaiting presentation abstract.

Improving the architecture of the GaN VCSEL

Presented by Tatsushi Hamaguchi, Researching Team Leader, Sony Corp.

This talk introduces the latest progress of Sony’s GaN-based visible VCSELs with features such as plane and curved mirrors made of dielectric materials. This novel class of GaN-based VCSELs allow small apertures down to 3 μm and long cavities of more than 20 μm without the occurrence of diffraction loss. These structures have enabled low threshold currents, high efficiency operation, and robust fabrication processes with high lasing yield. The proposed structure is facilitating the production of VCSELs formed on semi-polar plane GaN substrates and arrayed VCSELs, allowing green VCSELs and watt-class blue VCSEL arrays.

Optimizing 200mm Metal Lift-off for Smaller Dimensions

Presented by Philip Greene, Ferrotec

As the LED landscape moves from traditional LED to Mini and Micro LED form factors, the linewidth dimensions and spaces are shrinking. Pattern definition using Metal Lift-off becomes more challenging. A collaboration between vendors provides an opportunity to optimize the lithography, metallization and lift-off processes required for these smaller features. This is a continuation of work presented last year at CS Mantech. The current work is focusing on sub-500nm dimensions. As the line/space dimensions become smaller the resist thickness for the MLO structure becomes thinner. Optimizing the MLO structure and metallization parameters we have evaluated the metal thickness limits as a function of linewidth.

Recent trends in LED and LASER diode device material characterization

Presented by Yves Lacroix, President, YSystems Ltd

Sometimes reinventing the wheel can be the right path to advance technology. As industrialization of optical materials shifted from communication application centered NIR wavelengths to the blue spectrum of nitrides in the late nineties to then extend to deep ultraviolet emitter and sensor materials, we see it now trending back to the infrared and beyond for both communication and machine vision applications. The basic metrology concepts from 30 years ago still apply however automation, device optical sensitivity, lasers and other components that make up characterization equipment has tremendously evolved since then. We look at some of the things we can do now that we could not do then.

Refining microLED technology

Presented by Wei Sin Tan, Plessey Semiconductors

This presentation will focus on Plessey’s pioneering proprietary approach to enable manufacturing of monolithic microLED arrays using gallium nitride (GaN)-on-silicon (Si) technologies to develop better optimised AR/MR and wearable displays applications. It describes the problems associated with incumbent micro-display technologies which are prohibiting the advancement of new innovative technologies which microLEDs can help solve.

Presentation title to be confirmed

Presented by Jens Voigt, AIXTRON

Awaiting presentation abstract.

Presentation title to be confirmed

Presented by Samuel Sonderegger, Attolight

Awaiting presentation abstract.

 
Ramping volumes in the power electronics sector
This theme is sponsored by ClassOne Technology

Advanced in-situ metrology for high-yield epitaxy of SiC/SiC, GaN/SiC and GaN/Si device structures

Presented by Iris Claussen, Laytec

Expected market size growth especially of SiC-on-SiC based devices (key driver: automotive, e-mobility) and of GaN-on-SiC devices (key driver: 5G) placed several new challenges for improving the related MOCVD processes in yield, cost reduction and performance. In our contribution we focus on the newly developed capabilities of in-situ metrology for SiC-on-SiC structures (6” SiC wafer temperature sensing and wafer bow control) as grown in AIXTRON’s planetary warm-wall reactors. We further report on latest progress in multi-wavelength growth-rate control and improved absolute wafer temperature calibration for GaN-on-SiC MOCVD as well as on a latest break-through for GaN-on-Si wafer temperature sensing.

Delivering the best cost of ownership in PVD solutions for SiC Power applications

Presented by Silvan Wüthrich, Head of BU Semiconductor, Evatec

The Power Device industry is rapidly developing new SiC power products with best electrical performance, but this also requires new PVD system concepts with highly uniform coating thickness results and demanding run to run repeatability performance. As substrate costs play a significant role, proven system performance with high yield combined with high uptime / low maintenance time are essential to achieve the required CoO in production.

Driving the adoption of CoolGaN technology

Presented by Gerald Deboy, Infineon

With the commercial availability of GaN-based power devices, the positioning of the technology versus next best silicon or SiC-based alternatives is a hot topic in the industry. Reliability aspects and system benefits are key issues driving the adoption of the technology. We will discuss a number of use cases such as hyper-scale datacenter and high-density telecom power supplies to outline decision factors in favor of GaN-based solutions. We will compare performance indicators towards the next best alternatives. The talk addresses both power supply engineers as well as market analysts and trend scouts.

Driving the revolution in wide bandgap devices

Presented by John Palmour, CTO, Wolfspeed

Historically, silicon-based power semiconductors have served as the backbone of power systems, but wide bandgap (WBG) devices are changing this. As the market for these devices grow, it is important to understand what drives the commercial market to use WBG devices versus the more established Silicon technologies. WBG materials deliver results that aren’t possible with silicon in the areas of Power and RF. These improvements can have a significant impact in reducing overall electricity consumption worldwide, and in particular, SiC is enabling electric vehicles with longer range and lower cost. This adoption is driving a very rapid expansion for the SiC market and supply chain.

Expanding opportunities for 650 V GaN FETs

Presented by Frédéric Dupont, CEO, Exagan

GaN-on-Silicon is a key technology to sustain future power converter systems roadmaps in the field of IT electronics, renewable solar and emission free automotive applications. Exagan implemented proprietary 200-mm GaN-on-Silicon technology to accelerate GaN market adoption. G-FET™ & G-Drive™ product portfolio, provide extensive power range capabilities, as well as power switching solutions that combine the super-fast GaN-on-Silicon switch with its appropriate driver IC controlled by embedded diagnostics, protections and, much more functionalities. Those “easy to use” GaN solutions will help power innovators extending power conversion roadmaps, by creating smaller, more efficient and higher-performing power converters.

Latest technologies for laser dicing, blade dicing of SiC and new ultra-thin grinding

Presented by Gerald Klug, DISCO HI-TEC EUROPE

DISCO has developed laser full cutting and laser grooving over the recent years as a pillar of Kiru (=dicing) technology, alongside blade dicing. Ablation laser cutting can be used for full-cut dicing of various materials such as thin Si and GaAs, Germanium substrates as well as for laser grooving of metal and Low-k material. Stealth Dicing on the other hand is modifying the workpiece from the inside, creating a modified layer by focusing a laser inside the workpiece. The workpiece can be separated by an expander afterwards almost without material loss. This method is mainly used for MEMS, Glass, and Sapphire. We will also introduce Laser based applications like LEAF (Laser Enhanced Ablation Filling) and LLO (Laser Lift Off) for µLED production. KABRA is a new laser cutting method for slicing SiC ingots instead of use of a wire saw. Approx. 40% more SiC wafers can be gained from one ingot. Finally DISCO’s CONDOx technology allows for thinning wafers of all kind of materials to a final Si thickness of 25 μm, even with 200 μm high bumps, without residues and any wafer breakage.

Reinforcement Factories

Presented by Julie Orlando, Nanotronics

A factory is inherently made of moving parts in the form of process nodes. Led by complex statistical means and process-engineering expertise, a new set of models based on reinforcement learning and other deep-learning networks has the ability to transform factory optimization. Reinforcing agents in a factory environment allow for generative improvements in control and design, while maintaining predefined product-performance specifications. Examples of how this is being explored in Nanotronics’ labs and with partners will be presented, along with ideas of where the future for artificially intelligent factories is headed.

The SiC & GaN Power Semiconductor Market: Forecasts and Drivers

Presented by Richard Eden, IHS Markit

This presentation will share key findings from the latest IHS Markit Technology report on Silicon Carbide and Gallium Nitride Power Semiconductors. It will present the likely key applications, pricing trends, the supplier landscape and the latest ten-year forecasts by application for both technologies. It will identify which technologies can compete with silicon in terms of device type and likely adoption by end applications. The SiC & GaN wafer substrate supply chain will also be discussed. Finally, I will try to answer the question: Are Cree/Wolfspeed's expansion plans (announced in May 2019) intended to monopolize the SiC market?

Using high speed XRDI to improve and monitor SiC substrate quality

Presented by Paul Ryan, Director, Product Management, Bruker

A major issue faced by the SiC industry is linked to the question of how to ramp up the production and meet the ever-growing demand of materials for the power electronics sector. In order to achieve this, the SiC wafer supply needs to develop a means to drive the cost of production down. One method of doing this is by improving yield. Silicon Carbide wafer growth and device manufacturing have improved significantly but the process yields are still too low due to the high densities of crystalline defects, particularly as substrate sizes increase, which are damaging the device performance and their long-term reliability. It is therefore critical to develop new metrology techniques that are capable of detecting these defects allowing to understand how they form and giving a means to reduce or eliminate them. We introduce high speed X-ray diffraction Imaging (XRDI, sometimes known as X-ray topography) as one of these techniques. It enables the non-destructive detection of the detrimental TSDs, TEDs, SFs and BPDs on all types of SiC wafers, including n+ doped substrates, without some of the limitations of existing etch and optical inspection methods. It is a viable candidate to replace destructive KOH etching in the long term as a defect metrology and reduce the cost of SiC wafers manufacturing. In this talk we will discuss the latest developments in XRDI which enable fully automated high throughput measurements at high resolution for integration into modern wafer production lines to enable direct feedback into the process development.

Presentation title to be confirmed

Presented by Rob Rhoades, Revasum

Awaiting presentation abstract.

Presentation title to be confirmed

Presented by Cem Basceri, Qromis

Awaiting presentation abstract.

Presentation title to be confirmed

Presented by Ke Xu, Nanowin

Awaiting presentation abstract.

 
Enhancing the automobile
This theme is sponsored by ClassOne Technology

Compound semiconductor adoption by automotive market

Presented by Hong Lin, Principal Analyst, Yole Développement

Automotive market is an important market for electronics devices. The trend towards the electrification and the automation of cars create enormous market opportunity for compound semiconductor, including, Silicon Carbide (SiC), Gallium Nitride (GaN) , Gallium Arsenide (GaAs) and Indium Phosphide (InP), either for power electronics applications or sensing applications. In this presentation, we will give Yole’s understanding of compound semiconductor adoption by automotive market.

High-power blue VCSELs and VCSEL arrays

Presented by Masaru Kuramoto, Executive Chief Researcher, Stanley Electric

Blue vertical-cavity surface-emitting lasers (VCSELs) are strongly desired for many applications, including adaptive laser headlamps, retinal scanning displays, visible light communication systems, and processing of metals such as copper and gold. For many applications, high output powers and low-divergence output beams are preferred because they allow high efficiency fiber coupling and high optical density to be realized with very simple optics. This presentation will focus on recent progress in high power and mode control technologies of blue VCSELs and VCSEL arrays.

Speeding On-board Charging with Automotive-qualified GaN FETs

Presented by Philip Zuk, Vice President of Worldwide Technical Marketing & NA Sales, Transphorm

Now in production across several application markets, high voltage GaN has piqued the interest of hybrid and electric vehicle manufacturers. The technology’s proven ability to increase power density within various topologies as well as its attractive cost model have positioned GaN to reportedly cannibalize the on-board charger market currently attributed to SiC. The key to realizing this projection is the technology’s reliablity. Learn about the importance of extended validation tests, GaN’s current FIT rates and temperature ratings, and how a deep focus on reliability enables volume production from Transphorm—manufacturer of the industry’s first AEC-Q101 GaN FET.

Presentation title to be confirmed

Presented by John Ghekiere, ClassOne

Awaiting presentation abstract.

 
Taking wide bandgap devices to their ultimate limits
This theme is sponsored by Precision Febricators

A New Technology of Commercialization for GaN on Diamond HEMTs

Presented by Won Sang Lee, Director and General Manager of GaN/Diamond Division, RFHIC US Corp

A matured flip process to make 4” GaN/Diamond epitaxial wafer is driven by a need of commercialization for GaN/Diamond HEMTs. RFHIC announced that the power density of 23.2 W/mm at Vds = 100V is obtained at 2 GHz pulsed power measurement using on-wafer 4” GaN/Diamond HEMT manufactured at automation foundry FAB. The 0.35 um GaN/Diamond HEMT revealed Pout of 21.94 W/mm (at Vds = 100 V), 17.88 W/mm (at Vds = 100 V) in the frequency range of 3.6 GHz and 4.9 GHz, respectively. To make an improving yield and process consistency, RFHIC is developing permanent wafer bonding technology for GaN/Diamond HEMT processing not only for SiN passivation but also high temperature annealing without requiring a de-bonding step. A new type of flip process technology to make GaN/Diamond epitaxial wafer using GaN/SiC epitaxial wafer will be sure to generate a better quality of GaN/Diamond HEMT in the future.

Ramping production of gallium oxide diodes and transistors

Presented by Toshimi Hitora, President, FLOSFIA

Awaiting presentation abstract.

Presentation title to be confirmed

Presented by Marianne Germain, Chief Executive Officer, EpiGaN

Awaiting presentation abstract.

 
Theme to be confirmed

Presentation Title TBC

Presented by Martin Eibelhuber, EV Group

Awaiting presentation abstract.

 

BOOK YOUR PLACE FOR 2020 - 3 Events, 2 Days, 1 Ticket

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