CS International

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Two days, 5 themes, over 30 inspiring presentations

Presentation at CS International 2022 are grouped into 5 key themes which collectively provide complete coverage of the compound semiconductor industry.

If you are interested in speaking at CS International 2022, please contact info@csinternational.net or call +44 (0)24 7671 8970.

2022 Speakers Include

2022 Presentation Abstracts

Faster, more frugal networks

Accelerating production with the use of steppers for 5G pHEMTs

Presented by Barry Lin, Chief Technology Officer, Wavetek Microelectronics Corp.

TBA

Can adavances in compound semiconductors deliver a greener communication infrastructure?

Presented by Eric Higham, Principal Market Analyst, Strategy Analytics

The IPCC (Intergovernmental Panel on Climate Change) released their sixth assessment report in August 2021 and the report paints a catastrophic analysis of our current climate, along with several increasingly dystopian views for the future. The main culprit for this view is Carbon Dioxide emissions created by energy generation. This presentation will address some of the results creating this concern, along with a discussion of how 5G and 6G networks are addressing the energy consumption issues. The presentation will close with discussion of how the advantages of compound semiconductors will enable these future, greener networks.

Designing MMICs for 5G

Presented by Robert Smith, Senior Consultant Engineer, PRFI

To follow

Material Processing with Electrons

Presented by Stewart Sando, VP Business Development, Velvetch

To follow

Slashing the energy per bit with membrane lasers

Presented by Suguru Yamaoka, TBA, NTT

To follow

Multiple markets for microLEDs

Advancing the microLED with a silicon foundation

Presented by Alexander Loesing, TBA, Allos Semiconductors

To follow

Enhancing microLED performance with microstructures

Presented by Professor Rachel Oliver (TBA), TBA, Porotech

To follow

LightBundleTM - mircoLED based optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications

Presented by Jerome Veyret, Director of Operations, Avicena

Avicena is developing highly parallel LED based optical link technology for chip-to-chip interconnects in HPC, Cloud computing, and processor-to-memory disaggregation applications. The technology is based on arrays of novel GaN high-speed microLEDs, leveraging the LED display ecosystem, and Si based PDs integrated into a single CMOS chip and connected with multi-core fiber bundle. At energy efficiency of 10Tbps/mm2 @ < 0.5pJ/bit combined with excellent reliability over the industrial temperature range of -40°C to +150°C this new class of optical interconnects eliminates the inherent power, reach and interference limitations of electrical links in chip-to-chip communications.

MicroLEDs for structured illumination

Presented by Jan Gülink, CTO at Qubedot, Qubedot

GaN-based LEDs have established themselves over the last three decades as the dominant light source for the automotive sector up to general lighting. In contrast to these large-area highperformance LEDs, microLEDs (µLEDs) with dimensions of 1 to 50 µm are becoming increasingly interesting, mainly driven by developments in display technology. Beyond this application purpose, many other applications can be derived and have been proven by QubeDot’s SMILE Platform. SMILE is an acronym for “Structured Micro Illumination Light Engine” and covers our microLED array product range with different pixel counts and sizes, wavelengths and intensities. All light sources are directly driven via computer and pattern creation works out of the box. Technical details of these SMILE platforms and pilot application examples on how to utilize them within each application will be presented in the talk.