CS International 2026 returned to Brussels for two days of focused, in-depth coverage of the compound semiconductor industry, drawing the community together across materials, devices, and applications. Part of an AngelTech week that welcomed over 800 attendees and a sold-out exhibition floor, the conference featured a packed programme of presentations and panel discussions reflecting the pace of innovation across GaN, SiC, microLEDs, advanced laser technologies, and the ultra-wide bandgap materials shaping the next generation of devices.
What set this year apart was the depth of the conversation around real-world applications. Speakers and delegates explored how compound semiconductor innovation is translating into impact across AI infrastructure, data centres, automotive, healthcare, and sensing - not as isolated breakthroughs but as part of a wider, interconnected value chain. The addition of Advanced Packaging International alongside CS, PIC, and Power Electronics this year reinforced that point, with delegates moving freely between sessions and exhibition stands to see how materials, devices, packaging, and systems now operate as one ecosystem.
But the real value of CS International continues to be measured in conversations rather than counts. Three days under one roof with the engineers, founders, foundries, and end-users shaping the industry - that's where partnerships form, business gets done, and the next wave of innovation takes root. CS International 2026 delivered on that promise at greater scale and with greater connection than ever before.