PRESENTATION

PVA TePla Metrology Solutions for Compound Semiconductors

The first part of the talk will focus on the latest achievements in non-contact and non-destructive measurement of stresses and defects in compound semiconductor substrates using the Scanning InfraRed Depolarization (SIRD) method. In the second part of the talk, the correlation between bulk and wafer inspection will be presented using a dedicated scanner designed for digital defect traceability. The system is intended for companies aiming to automate SiC puck quality assessment and optimize raw material allocation to downstream processes, such as laser splitting and multi-wire sawing.

Ivan Orlov

PVA TePla AG

Ivan is the founder and CEO of Scientific Visual, a Swiss company redefining quality inspection in industrial crystals. With a unique blend of expertise in materials science, electronics, and executive leadership, Ivan has led Scientific Visual from concept to global recognition, building innovative solutions for the world’s most demanding crystal markets. Ivan holds a PhD in Materials Science from the Swiss Federal Institute of Technology (EPFL), a Master’s in Electronic Engineering, and has completed executive education at IMD Business School.

Markus Stöhr

PVA TePla AG

Coming from mechanical engineering and through his PhD-research in anisotropic photo-elasticity, Markus brings an extensive knowledge in optical stress measurement, continuum mechanics and fracture mechanics. Since 2021, he joined PVA Metrology & Plasma Solutions as head of the laser metrology department being responsible for the optical stress measurement tool SIRD.