Presentation by NHanced Semiconductors

Robert Patti

NHanced Semiconductors

Bob Patti is the owner and President of NHanced Semiconductors. Previously, Mr. Patti founded ASIC Designs Inc, an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he participated in the design of over 100 chips. Tezzaron Semiconductor grew from that company, with Bob as its CTO, and became a leading force in 3D-IC technology. NHanced Semiconductors was spun out of Tezzaron to further advance and develop 2.5D/3D technologies, chiplets, die and wafer stacking, and other advanced packaging. Under Bob’s leadership, NHanced has become the foremost provider of advanced packaging to businesses around the world. Mr. Patti received the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC's DDRIII / Future Memories Task Group, and holds 21 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor chip technologies. He holds a BSEE/CS and BSPH from Rose-Hulman Institute of Technology.