PRESENTATION

Beating the Heat: Diamond as an Enabler for High-Performance Advanced Packages

As device power densities continue to rise in AI, HPC, and power electronics, thermal management has become one of the most pressing bottlenecks in advanced packaging. Diamond, with its unmatched thermal conductivity, high bandgap and radiation hardness, offers a unique pathway to overcome these challenges. This talk will highlight recent advances in integrating synthetic diamond into advanced packaging — from heat spreaders and chip-carriers to on-die caps — enabling significant reductions in hotspot temperatures and improvements in energy efficiency. Potential applications will be discussed for both data centers, where cooling demands are escalating, and space electronics, where thermal reliability under extreme conditions is mission-critical.

Joana Mendes

Instituto de Telecomunicações

Joana Catarina Mendes is a researcher at Instituto de Telecomunicações, Aveiro, Portugal, specializing in the integration of synthetic diamond for thermal management in advanced packaging and heterogeneous 3D architectures. She has authored over 60 publications, led and contributed to multiple international R&D projects, and is a member of the Assembly and Manufacturing Technology sub-committee of the IEEE Electronic Components and Technology Conference (ECTC).