Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of compact optical integration platforms in advanced photonics packaging. Here we will address the critical aspects of progressing photonic integration of PICs to scalable, high-volume production: broad compatibility with various material platforms, reproducibility, long-term reliability in Telcordia testing and seamless integration with existing packaging technologies.
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