DISCO Corporation is a leading manufacturer of equipment and consumables for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. By combining our three core technologies, DISCO provides total solutions to meet the more and more demanding requirements of the semiconductor industry in terms of manufacturing thin dies with high die-strength and several new approaches for advanced packaging. Due to its high rigidity, SiC is difficult and slow to process at high costs. In order to solve these issues, DISCO has developed several solutions from substrate making over polishing up to thinning and sawing, always focusing on mass production of SiC wafers at very high quality and improved CoO. These solutions can also be partly applied on new generation of GaN-wafers.
Gerald Klug graduated with a diploma in business engineering at the University of Siegen in 1998. He completed his thesis at BMW in Munich. His career started in designing and project engineering of steel cutting lines at a globally leading German machine manufacturing company. At the end of 2000, Gerald joined DISCO in Munich as Sales Engineer for the area of Scandinavia and the U.K. Meanwhile he is operating as the General Sales Manager for Europe, combined with a deep affinity to technology and application.