PRESENTATION

Implantation and Compound Semiconductor Platforms at the Center of Tomorrow's Networks

II-VI is enabling multiple current market and technology megatrends, from the digital transformation of information networks, convergence of communications, computing and sensing, to vehicle and industrial electrification and the growth of a green power infrastructure. Thanks to our vertical integration structure and capabilities, starting from the base materials and moving up through processing and component integration, we are relentlessly building broader and more innovative solutions to serve these high growth markets. Ranging from GaAs and GaN based devices for RF electronics, optoelectronics and 3D sensing devices, to SiC substrates, devices and modules for Power electronics, II-VI continues to work at furthering our mission of enabling the world to be safer, healthier, closer, and more efficient. In this talk, we will present the latest developments from our ion implantation foundry which provides state-of-the-art services in this current and unprecedented fab environment for compound semiconductor manufacturers. We will review general innovation trends currently seen in ion implantation for compound semiconductors, such as heated ion implantation, damage engineering and the use of channeling mechanism. We will also discuss how our tailored ion implantation and engineering support, from design and simulation through processing enables CS device manufacturers to remain at the forefront of innovation.