Conformal and pin-hole free thin films enable existing and new nanomaterials for future technologies. Atomic layer deposition (ALD) is unrivaled for gas-phase deposition of conformal, dense, well-adhered, pin-hole free thin films to non-line-of-site structures. This talk will cover the tradeoffs in ALD between uniformity and speed in thin film processes, development of the “ALDx” technology to conformally coat high surface area nanofeatures at 100% step coverage, at speed of greater than 10 nm/minute, and some topical examples of applications for ALD technology on compounds semiconductor devices. ALDx thus enables the viability of conformal ALD coatings, with device relevant film properties, in multiple device applications within the compounds semiconductors field.
Dr. Matt Weimer is an R&D Scientist at Forge Nano who specializes in object and semiconductor applications for atomic layer deposition. With a background in synthetic organometallic chemistry, experience in device characterization, and novel ALD tool development, he has hands-on experience with the full life cycle of ALD. Matt has a BS in Chemistry from the University of Washington and a PhD from the Illinois Institute of Technology with a joint graduate appointment at Argonne National Laboratory. After a postdoc at Argonne, he joined the R&D deposition group at Lam Research, where Matt spent time on new product development. Utilizing his synthetic chemistry background, he developed multiple ALD and CVD solutions, on a variety tool sets, for a range of applications in both logic and memory. Matt has multiple papers, patents, and talks in the fields of synthetic chemistry, ALD and CVD. In his spare time, he is an avid racquetball player, hiker, and traveler.