As the LED landscape moves from traditional LED to Mini and Micro LED form factors, the linewidth dimensions and spaces are shrinking. Pattern definition using Metal Lift-off becomes more challenging. A collaboration between vendors provides an opportunity to optimize the lithography, metallization and lift-off processes required for these smaller features. This is a continuation of work presented last year at CS Mantech. The current work is focusing on sub-500nm dimensions. As the line/space dimensions become smaller the resist thickness for the MLO structure becomes thinner. Optimizing the MLO structure and metallization parameters we have evaluated the metal thickness limits as a function of linewidth.
Phil Greene is the R&D Manager for Temescal products at Ferrotec (USA) Corporation. For the past 17 years he has worked on the development of processes and equipment for physical vapor deposition of thin films. At Ferrotec he is engaged in the development of improved uniformity and control of electron beam evaporated films, including TCO and alloy films. Before joining Ferrotec in 2010 he was Member Technical Staff at Applied Materials, where he developed processes for reactive and non-reactive sputter deposition of films for architectural glass and thin film photovoltaic applications. Phil received a Bachelor’s degree in Physics from the University of California, Los Angeles and a Ph.D. in Physics from the University of Colorado, Boulder.