PRESENTATION

Dry Etching and Plasma Dicing Technology for Compound Semiconductor Materials

Currently, compound semiconductors have attracted a lot of attention as post-Si semiconductors in various fields such as high frequency, light, and power devices become more popular. Among them, vertical-cavity surface-emitting lasers (VCSELs) are now key optical sources in gigabit ethernet high-speed optical-area networks and computer links due to their low threshold current and small structure. In our presentation, Panasonic will introduce the latest developments in dry etching processes for various compound materials such as GaAs, GaN and SiC. In addition, the latest trends in technology of GaAs plasma dicing for VCSELs will be reported.

Toshiyuki Takasaki

Panasonic

Toshiyuki Takasaki is a process engineer at Panasonic Smart Factory Solutions in Osaka, Japan. He spent most of his career in the development of dry etching and plasma dicing equipment and processes for compound semiconductors. He holds a master’s degree in electronic engineering from Kyushu University, Japan.