PRESENTATION

Material Processing with Wafer Scale Waves of Precisely Controlled Electrons

Electron Enhanced Material Processing EEMP™ Systems provide compound semiconductor device manufacturers with new processing capabilities, including, high throughput atomic layer etching, atomically smooth polishing, and stoichiometry-preserving, damage-free etching and cleaning at room temperature without cooling for small research substrates up to 300mm production wafers. VelvEtch EEMP Systems utilize a unique, asymmetrical bias-signal to pull discrete, wafer-scale, waves of precisely controls electrons from a DC plasma to drive excited-state surface chemistry reactions at material-specific, electron-energy dependent thresholds to deliver processing results that open up new opportunities to improve device performance and reduce device costs.

Stewart Sando

VelvEtch

Stewart Sando is the VP of Business Development at VelvEtch in Pasadena, California. In addition, he contributes to the development of EEMP processing recipes for applications ranging from the etching of device structures in compound semiconductors to the etching of quantum well material stacks, as well as, processing recipes for the modification of polymer surfaces for bio-medical implant applications. Previously, Stewart managed groups responsible for RISC processors, DSP’s, ASIC’s, memory chips, laser chips, and wireless and automotive components while at Silicon Valley companies, including Intel and Hitachi Semiconductor. Stewart earned his BS in Physics and MS in Electrical Engineering at the California Institute of Technology.