PRESENTATION

LightBundle™ - microLED based optical interconnects with 10Tbps/mm² @ < 0.5pJ/bit for chip-to-chip communications

Avicena is developing highly parallel LED based optical link technology for chip-to-chip interconnects in HPC, Cloud computing, and processor-to-memory disaggregation applications. The technology is based on arrays of novel GaN high-speed microLEDs, leveraging the LED display ecosystem, and Si based PDs integrated into a single CMOS chip and connected with multi-core fiber bundle. At energy efficiency of 10Tbps/mm2 @ < 0.5pJ/bit combined with excellent reliability over the industrial temperature range of -40°C to +150°C this new class of optical interconnects eliminates the inherent power, reach and interference limitations of electrical links in chip-to-chip communications.