PRESENTATION

Scalable MicroLED optical link prototype fabrication for the next generation computing

CEA is working on a massively parallel MicroLED based optical links for point to point interconnects (xPU/xPU, xPU/HBM) to be used on board and in rack in HPC and data centers. They could enable, for example, pooled or shared memory / GPU architectures. Our approach combines device and circuit optimization, 3D integration such as hybrid bonding & high density TSVs, and system modelling, enabling scalable fabrication on 200 mm and 300 mm in standard foundries. We are aiming to reach