DISCO has developed laser full cutting and laser grooving over the recent years as a pillar of Kiru (=dicing) technology, alongside blade dicing. Ablation laser cutting can be used for full-cut dicing of various materials such as thin Si and GaAs, Germanium substrates as well as for laser grooving of metal and Low-k material. Stealth Dicing on the other hand is modifying the workpiece from the inside, creating a modified layer by focusing a laser inside the workpiece. The workpiece can be separated by an expander afterwards almost without material loss. This method is mainly used for MEMS, Glass, and Sapphire. We will also introduce Laser based applications like LEAF (Laser Enhanced Ablation Filling) and LLO (Laser Lift Off) for µLED production. KABRA is a new laser cutting method for slicing SiC ingots instead of use of a wire saw. Approx. 40% more SiC wafers can be gained from one ingot. Finally DISCO’s CONDOx technology allows for thinning wafers of all kind of materials to a final Si thickness of 25 μm, even with 200 μm high bumps, without residues and any wafer breakage.
Gerald Klug studied business-engineering at the University of Siegen and graduated as Diplom-Engineer in 1998, completing his thesis at BMW. He started his carrier as a designer and project engineer of steel cutting lines at a globally leading German machine manufacturing company. At the end of 2000, he joined DISCO as Sales Engineer for the area of Scandinavia. Meanwhile he has been working for DISCO for 19 years and is nowadays operating as General Sales Manager for the territory of Europe.