PRESENTATION

Enhancing Yield in Compound Semiconductor Processing

In the compound semiconductor industry, a wide variety of materials is used to manufacture different devices such as LEDs, sensors, and imagers. Because these materials are uncommon compared to silicon, their processing requires different technologies and process steps. In this environment, any loss in yield has a significant negative impact on production efficiency and cost. One critical process step is wafer dicing, which is known to be very contaminating and can strongly reduce yield due to particle generation and surface contamination. An effective post-dicing cleaning process is therefore essential to recover and improve yield. SicOzone™ enables an efficient post-dicing cleaning step that improves wafer cleanliness and supports higher overall yield.