PRESENTATION

From Innovation to High-Volume Production: Scaling Heterogeneous Integration and Co-Packaged Optics

The rapid growth of bandwidth demand in data centers and high-performance computing is accelerating the adoption of integrated photonics and co-packaged optics (CPO). This presentation examines how heterogeneous integration using 2.5D and 3D packaging architectures enables tight integration of photonic devices with advanced logic and memory. Key challenges in scaling photonic integration to high-volume manufacturing—including optical alignment, thermal management, electrical–optical co-design, and yield—are discussed. The talk highlights process and packaging innovations that support reliable, cost-effective deployment of co-packaged photonic systems.