PulseForge and Teikoku Taping System (TTS) will introduce a fully automated photonic debonding system with tape mounting and detaping capabilities. This tool seamlessly integrates PulseForge's revolutionary photonic debonding solution with TTS's state-of-the-art wafer handling technology, offering a cost-effective, clean, and high-throughput solution that has the potential to transform the electronics packaging industry. The photonic debonding process utilizes sophisticated flash lamps to generate high-intensity light pulses along with a reusable inorganic light absorber layer. This innovative technology enables the seamless separation of temporarily bonded wafer-pairs for critical processes such as wafer thinning, RDL build, Fan-out, and substrate transfer. This presentation will address the specifics of the photonic debonding process, highlighting its ability to separate temporarily bonded wafers from glass carriers with minimal stress. Successful debonding results for various thinned wafers (
Dr. Vahid Akhavan is the Director of Transitional Technologies at PulseForge. Enabling the next generation of electronic devices by drawing on his expertise in colloidal synthesis, additive manufacturing, and digital thermal processing. He has over 20 peer reviewed publications, several patent applications and has presented at numerous technical seminars and workshops. Throughout 15 years of experience in the electronics field, he has worked to bring manufacturing solutions to difficult, and seemingly impossible, design and production challenges.