Silicon Carbide’s rise to be "the next big thing“ in the Semiconductor market is out of question when looking at its exciting material characteristics; however, these characteristics do not only bring new possibilities, but also new challenges, especially when it comes to high volume production of SiC technologies. To master these challenges, new technical innovations have to be introduced in wafer fab tools to securely and reliably handle, identify and process SiC wafers in a large scale, paving the way to a mass use of wide-bandgap semiconductor technology.
David Liese is the Vice President at htt Group’s Equipment Division. Before joining HTT in 2021 he worked in technical marketing within the Semiconductor Industry for 10 years, being involved with various wafer probing & testing products. He also served as a consultant for well-known semiconductor test events ITWS – European IS Test Workshop (Munich, Germany) and SWTest Conference (San Diego, USA) as well as SWTest Asia (Hsinchu, Taiwan). At htt Group, David is particularly specialized in Advanced Vertical Probecards and Temperature Forcing Systems.
Michael Köppl is Senior Sales Engineer at htt Group, a Munich based company and a major supplier to the Semiconductor Industry representing well-known leading manufacturers of systems and consumables, tools for Wafer Fab, Probing, Test, Assembly and Backend. Michael is a technical based Sales Engineer and has been working for more than 10 years in the Semiconductor Industry. He has additional extensive experience in electronics, microscopy and laser technology. At htt Group he is your contact for Wafer ID Readers, systems for AOI, Wafer handling tools (Sorter, Packer, Wafer Transfer), Wafer & reticle contamination standards and ESD & CDM testing.