As compound semiconductor devices rapidly advance from novel, enabling technologies into mainstream products, economic realities long familiar to logic and memory markets figure prominently. Whereas function historically trumped process efficiency in an industry dominated by technology, unit process costs and device yield present new requirements to a burgeoning manufacturing industry - especially so for automotive and military applications. Formation of features in gold now rises in prominence not just as a necessary process step, but as a target for simultaneous improvement in throughput, per wafer costs and yield. This presentation describes how electrochemical deposition of gold readily enables all three.
John Ghekiere is Senior Director of Product and Technology for ClassOne Technology. He is a 23-year veteran of the semiconductor wet processing equipment industry. Mr. Ghekiere has contributed to or led numerous hardware and process development efforts to bring enabling technologies into volume device manufacturing, including plating and surface preparation. In his current role, Mr. Ghekiere is responsible to identify new industry needs and drive rapid development of hardware and process solutions into manufacturing-ready applications. He operates out of ClassOne Technology’s TDC (Technology Development Center) in Kalispell MT USA.