Elisabeth Brandl is business development manager at EV Group for temporary bonding and metrology. She holds a Masters degree (DI) in technical physics from the Johannes Kepler University Linz specialized on nanoscience and - technology.
Since the 10 years she has been at EVG, she has, amongst other topics, been responsible for the UV laser debonding launch. She has published several articles and papers in the field of temporary bonding and metrology.
This presentation will focus on the realization of vertical GaN power devices grown on foreign substrates by employing temporary wafer bonding for mechanical support during substrate thinning and backside etching, complemented by metal bonding for heat sink and drain contact integration. Multiple device architectures, comprehensive process flows, and experimental results will be presented and analyzed.