Umesh Chand
Senior Scientist and Project Lead
A*STAR
Dr. Umesh Chand is a Senior Scientist at Singapore’s Agency for Science, Technology and Research Institute of Microelectronics (A*STAR IME). He obtained his Master’s degree from the Indian Institute of Technology (IIT) Roorkee, India, and his Ph.D. in Electronics Engineering from National Chiao Tung University (NCTU), Taiwan. His Ph.D. research earned him both the High Achievement CTCI Foundation Award and the Best Thesis Research Award. He successfully led the development of IME’s first 1.2 kV SiC power MOSFETs. His current research focuses on wide bandgap semiconductor technologies, with a particular emphasis on SiC MOSFET device development and process integration.
Presentations
Enabling Advanced Silicon Carbide R&D with 200-mm Open-Innovation Pilot Line at IME, A*STAR Singapore
Silicon carbide (SiC) has emerged as a key wide-bandgap semiconductor for next-generation power electronics, driven by increasing demand for high-efficiency, high-voltage, and high-temperature operation in applications such as electric vehicles, renewable energy systems, and industrial power conversion. To address the need for scalable and manufacturing-ready advanced SiC technologies, the Institute of Microelectronics (IME), A*STAR, Singapore, has established a 200-mm open-innovation SiC pilot line. This talk provides an overview of advanced SiC technology platforms developed recently. The pilot line offers an integrated and flexible environment for the co-development and evaluation of next-generation SiC power device technologies, materials, and processes with emphasis on wafer-level uniformity, cost efficiency, and manufacturability. Besides high-quality fabrication, our pilot line enables rapid learning cycles for partners. Key technology modules spanning from SiC epitaxial growth, high resolution lithography, ion implantation, advanced trench processing, gate dielectric engineering including high-K, Ohmic contact formation, and full device integration, alongside ongoing progress in backend integration and power module packaging will be introduced in the talk.