Markus Stöhr
Head of Laser Metrology Department
PVA TePla AG
Coming from mechanical engineering and through his PhD-research in anisotropic photo-elasticity, Markus brings an extensive knowledge in optical stress measurement, continuum mechanics and fracture mechanics. Since 2021, he joined PVA Metrology & Plasma Solutions as head of the laser metrology department being responsible for the optical stress measurement tool SIRD.
Presentations
PVA TePla Metrology Solutions for Compound Semiconductors
The first part of the talk will focus on the latest achievements in non-contact and non-destructive measurement of stresses and defects in compound semiconductor substrates using the Scanning InfraRed Depolarization (SIRD) method. In the second part of the talk, the correlation between bulk and wafer inspection will be presented using a dedicated scanner designed for digital defect traceability. The system is intended for companies aiming to automate SiC puck quality assessment and optimize raw material allocation to downstream processes, such as laser splitting and multi-wire sawing.