How Artificial Intelligence Heralds the New Era of Wafering

Independently from the material, wafer substrates undergo a long way from raw material to epi-readiness polishing results. The ongoing miniaturization of chip structures and the simultaneously increasing requirements for wafering processes, such like wafer slicing and surface finishing, generate a more and more complex environment for process developers and operators. The permanent pressure of working between Cost of Ownership effective processes and realizing the highest possible quality, ideally with maximized machine uptime and production yield challenge wafer manufacturers more than ever. Lapmaster Wolters solves these challenges with its innovative Lapmaster Wolters Precision AI approach, which uses data-based advanced analytics of dozens of data sources from its slicing and polishing machines to help process developers and operators to do both – Maximize the desired wafer quality while minimizing the overall Cost of Ownership by preventing time-consuming downtimes or costly material losses. The usage of comprehensive data-based software solutions will revolutionize the way of process development, since sophisticated coherences and parameter dependencies become visible and easily interpretable, even for unexperienced staff.