Frédéric Falise has over 30 years of experience in corporate roles within the high-tech industry. He holds an MD in engineering along with business diplomas from Kellogg and IMD business schools. His expertise lies in the strategic development of crystal inspection technologies, business planning, and go-to-market strategies. He is COO of Scientific Visual (Switzerland) – the industry leader in automated crystal inspection solutions, working in strategic partnership with PVA TePla since 2024.
The first part of the talk will focus on the latest achievements in non-contact and non-destructive measurement of stresses and defects in compound semiconductor substrates using the Scanning InfraRed Depolarization (SIRD) method. In the second part of the talk, the correlation between bulk and wafer inspection will be presented using a dedicated scanner designed for digital defect traceability. The system is intended for companies aiming to automate SiC puck quality assessment and optimize raw material allocation to downstream processes, such as laser splitting and multi-wire sawing.