Integrated Metal Etch and Photoresist Strip Solution for SiC Manufacturing

In traditional semiconductor wafer fabrication facilities, wet etching and stripping processes are typically carried out in separate equipment. However, Siconnex equipment enables the integration of multiple processes within a single tool. This capability provides clear advantages, as it allows for several etching and stripping steps to be performed within a unified process flow. This integrated approach enhances wafer quality by improving uniformity and etch control, while also reducing the need for operator intervention. Furthermore, it optimizes chemical usage and enables more precise process control. An example process flow in the Back-End of Line (BEOL) for materials such as Ag (silver), Ni (nickel), Ti (titanium), and photoresist stripping highlights these benefits, demonstrating how integrated processing can streamline operations, improve throughput, and achieve higher-quality results.