SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Wafer Inspection and Thickness Measurement Tools and HVM experience

Power, automotive, and IoT device manufacturers are constantly confronted with the simultaneous need to fulfill stringent quality requirements, boost productivity on their production lines, and reduce the associated cost of ownership (CoO). Inline inspection and measurement of high volumes of critical wafers is becoming increasingly crucial. SCREEN Semiconductor Solutions is addressing this specific market need with a portfolio of dedicated tools, specifically designed to reduce tool cost, footprint, downtime. The SCREEN Semiconductor Solutions proposal with the ZI-3500 is able to cover customer’s needs, with the front side micro inspection, for smaller and fine defects detections, to the back side and back side edge macro inspections to detect deposits and edge cracks that cause wafer damage, ensuring the large area coverage. While the ZI-3600 can even double the throughput capacity, these tools family can also achieve automatic defects classification, thanks to new advanced AI functions, reducing the operation time, and working time cost. On the thickness measurement front, the VM-3500 system offers spectroscopic reflectometry integrated with high-throughput features, while the RE-3500 system, combines single-wavelength spectroscopic ellipsometry, with triple reflectometry heads with the option to integrate the “trench shape measurement” application.