# CS International 2026 Programme

Two days of technical talks, panels and networking across compound semiconductor materials, devices and applications. Sessions and timings below are subject to change.

## Sunday 19 April 2026 (starting at 11:00 CET)

- 11:00 - AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register
- 18:00 - Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

## Monday 20 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Chris Meadows and Tim Bettles - Conference Chairs

**Theme: Growing Revenues in GaN Power Electronics**

- 09:00 - Radiation Hardened High Voltage GaN Technology to Enable a Permanent Human Presence on the Moon and Beyond - presented by Antxon Arrizabalaga (Semi Zabala)
- 09:15 - Advancing GaN Power Technologies: Scaling to 300 mm for the AI Era - presented by Pierre Gassot (inTEC GROUP)
- 09:30 - Analytical X-Ray Solutions for Thin Film and Wafer Analysis - presented by Andrey Zameshin (Malvern Panalytical)
- 09:45 - Leading Epitaxy Solutions for High Volume Manufacturing of Compound Semiconductor & Optoelectronic Devices - presented by Dr. Nicolas Muesgens (Aixtron)
- 10:00 - D3GaN Power Modules for Automotive Inverters Achieving 99.7% WLTP Efficiency - presented by Dieter Liesabeths (VisIC Technologies)
- 10:15 - GaN Comes of Age: From Fast Chargers to Strategic Power Platforms - presented by Roy Dagher (Yole Group)
- 10:30 - Morning Break - Refreshments & Networking
- 11:00 - Improving GaN with a Dash of Oxygen - presented by Robert Mears (Atomera)
- 11:15 - Chemical Vapor Deposition of Nitrides by Carbon-free Precursors - presented by Stefano Leone (Fraunhofer Institute IAF)
- 11:30 - Revelios: Semi-Automated, Non-Destructive Crystalline Defect Metrology for GaN-Based Epitaxial Layers - presented by Martin Čalkovsky (Thermofisher)
- 11:45 - Tunable Epi System for RF GaN HEMT - presented by Ray (Dongsik) Suh (TES Co. Ltd)
- 12:00 - High Performance GaN Power Devices Enabled by Wafer Bonding - presented by Elisabeth Brandl (EV Group)
- 12:15 - Accelerating GaN Process Development through Modeling: from Recipe to Device Characteristics - presented by Andrey Smirnov (STR)
- 12:30 - WiseGan Gen2: Integrated GaN SiP Unlocking New Power Architectures with Digital Control - presented by Ridha Hamza (Wise Integration)
- 12:45 - Lunch Break & Networking
- 14:15 - Startup Elevator Presentations

**Theme: Revitalising the SiC industry**

- 14:25 - Quantifying What Matters in SiC Fabs: Inline TXRF, HRXRD, and XRR for Yield Control - presented by Frank Hofmann (Rigaku)
- 14:40 - Further Growth Opportunities for SiC in New Application Fields - presented by Peter Friedrichs (Infineon)
- 14:55 - Enhancing Yield in Compound Semiconductor Processing - presented by Serge Jedwab (Siconnex)
- 15:10 - SiC: The Trusted Partner and Growth Engine for the High-Power Conversion Industry - presented by Mrinal K. Das (Onsemi)
- 15:25 - Afternoon Break and Networking
- 16:10 - Advanced Metrology Strategies for High-Yield SiC Manufacturing in Mature and Emerging Power Markets - presented by Tamzin Lafford (Bruker)
- 16:25 - Electrical Parametric Characterization of Wide-Bandgap Semiconductor Wafers and Devices - presented by Maarten Raimond (Tektronix)
- 16:40 - RAITH VECTOR in Compound Semiconductors - presented by Jean-Claude Menard (Raith)
- 16:55 - 3 Decades of SiC Innovation Leading to 200 mm Production and Full Vertical Integration - presented by Manuel Gärtner (STMicroelectronics)
- 17:10 - Closing Remarks
- 18:00 - Networking Drinks and Dinner Reception (concludes around 20:00)
- 18:30 - AngelTech Rump Session - Bottlenecks & Battlegrounds: The Future of the AI Chip Ecosystem - presented by David Cheskis (Square Zero Technologies), Diana Khlan (Chips Weekly)

## Tuesday 21 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Conference Chairs

**Theme: Advancing a broadening laser portfolio**

- 09:00 - Development of Strain-compensated Distributed Bragg Reflectors for GaN-based VCSELs With Potential for Faster Growth and Higher Productivity - presented by Takeshi Kawashima (Vicor)
- 09:15 - Unlocking the Future: Nanoporous Compound Semiconductor Technology for Next-Gen Sensing, Digital Health and Energy-Efficient Data Centers Optical Interconnect - presented by Jung Han (InPHRED)
- 09:30 - Manufacturing VCSELs on 150mm and 200mm Wafer Formats - presented by Peter Smowton (Cardiff University)
- 09:45 - Enabling As/P Epitaxy at Scale for Photonics, Optoelectronics, and Solar - presented by Vinod Merai (Ekco)
- 10:00 - Advanced Volume Manufacturing InP Etching on 150 mm Wafers Using High Temperature and Reliability Electrostatic Chuck - presented by Zhanxiang Zhao (Oxford Instruments)
- 10:15 - Developments in Surface Emitting Lasers and Component technologies - presented by Graham Berry (Huawei Bragg Research Center (UK))
- 10:30 - Photonic Crystal Surface Emitting Lasers – Their Potential for Advanced Communications - presented by Richard Taylor (Vector Photonics)
- 10:45 - Morning Break - Refreshments & Networking

**Theme: microLEDs: How to gain market traction**

- 11:15 - From Display to System: Enabling System-on-Panel Architectures Using MicroLEDs and MicroSolid Printing™ - presented by Reza Chaji (VueReal)
- 11:30 - Scalable MicroLED Optical Link Prototype Fabrication for the Next Generation Computing - presented by Vygintas Jankus (CEA Leti)
- 11:45 - Building a Silicon Fab-Compatible Supply Chain for MicroLED Manufacturing - presented by Alexander Loesing (Allos Semiconductors)
- 12:00 - Lunch Break & Networking

**Theme: Unlocking the potential of ultra-wide bandgap materials**

- 13:30 - Gallium Oxide RF Electronics: Recent Advances Toward Unlocking UWBG Potential - presented by Min Zhou (Xidian University)
- 13:45 - 12" SiC – Wafering Solutions for AR and Advanced Packaging - presented by Malte Mueller (Lapmaster Wolters)
- 14:00 - High Voltage Power Technology with Gallium Oxide and AlGaN - presented by Martin Kuball (University of Bristol)
- 14:15 - Towards More Efficient Power Transistors: Modulation-Doped β-(AlₓGa₁₋ₓ)₂O₃/Ga₂O₃ Heterostructures with Enhanced Electron Mobility - presented by Andreas Fiedler (Leibniz-Institut für Kristallzüchtung (IKZ))
- 14:30 - A Soft-Switching-Based Inverter Topology for High-Efficiency Applications - presented by Ajay Poonjal Pai (Sanan)
- 14:45 - Gallium Oxide from Epitaxy to Device Demonstration - A Holistic Approach to Ultra-Wide Bandgap Power Electronics - presented by Saptarsi Ghosh (Swansea University)
- 15:00 - Closing Remarks

Sessions and timings are subject to change.

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